SEMICONDUCTOR DEVICE

• Main Authors: YANASE AKIHIRO, SERIZAWA SHINYA
• Format: Patent
• Language: English; Japanese
• Published: 02.02.2015
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve at least one of improvement in degree of layout freedom and noise reduction.SOLUTION: A semiconductor device comprises an adhesion layer 90 for bonding a first electrode plate 60 or a second electrode plate 100 with an insulating member 70. The insulating member 70 includes a first resin material 130 added with a dielectric filler 132. The adhesion layer 90 includes a second resin material 140 added with a conductive filler 142 having an average particle diameter smaller than that of the dielectric filler 132. A capacitor 110a comprises the first electrode 60, the second electrode plate 100, the insulating member 70 and the adhesion layer 90. 【課題】レイアウトの自由度の向上及びノイズの低減の少なくとも一方が可能な半導体装置を提供する。【解決手段】半導体装置は、第１電極板６０又は第２電極板１００と絶縁部材７０とを接着させる接着層９０を備える。絶縁部材７０は、誘電体フィラー１３２が添加された第１樹脂材１３０を含む。接着層９０は、誘電体フィラー１３２よりも平均粒径が小さい導電性フィラー１４２が添加された第２樹脂材１４０を含む。第１電極板６０、第２電極板１００、絶縁部材７０及び接着層９０によりコンデンサ１１０ａが構成される。【選択図】図７