METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING COMPONENT FOR SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING REFLECTOR, AND COMPOSITION FOR FORMING REFLECTOR
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light emitting device having a reflector with excellent heat resistance and moldability, and a method for manufacturing a component for the semiconductor light emitting device.SOLUTION: A method for manufacturing a semicondu...
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Language | English Japanese |
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02.02.2015
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Abstract | PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light emitting device having a reflector with excellent heat resistance and moldability, and a method for manufacturing a component for the semiconductor light emitting device.SOLUTION: A method for manufacturing a semiconductor light emitting device 1 having a substrate 14, an optical semiconductor element 10, and a reflector 12 for reflecting the light emitted from the optical semiconductor element 10, comprises: a step for injection-molding a composition for forming the reflector, which contains at least an ionizing radiation curable resin, a white material, and a crosslinking treatment agent of which 2% weight loss temperature is equal to or more than 169°C; and a step for irradiating with the ionizing radiation one or both of before the step for injection-molding and after the step. The method solves above problems.
【課題】耐熱性と成形性に優れた反射体を備えた半導体発光装置の製造方法及び半導体発光装置用部品の製造方法等を提供することにある。【解決手段】基板14と、光半導体素子10と、光半導体素子10が発光する光を反射させる反射体12とを有する半導体発光装置1の製造方法であって、電離放射線硬化性樹脂と白色材料と2%重量減少温度が169℃以上の架橋処理剤とが少なくとも含まれている反射体形成用組成物を射出成形する工程と、その射出成形する工程前及び工程後の一方又は両方で電離放射線を照射する工程とを有する方法により、上記課題を解決する。【選択図】図1 |
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AbstractList | PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light emitting device having a reflector with excellent heat resistance and moldability, and a method for manufacturing a component for the semiconductor light emitting device.SOLUTION: A method for manufacturing a semiconductor light emitting device 1 having a substrate 14, an optical semiconductor element 10, and a reflector 12 for reflecting the light emitted from the optical semiconductor element 10, comprises: a step for injection-molding a composition for forming the reflector, which contains at least an ionizing radiation curable resin, a white material, and a crosslinking treatment agent of which 2% weight loss temperature is equal to or more than 169°C; and a step for irradiating with the ionizing radiation one or both of before the step for injection-molding and after the step. The method solves above problems.
【課題】耐熱性と成形性に優れた反射体を備えた半導体発光装置の製造方法及び半導体発光装置用部品の製造方法等を提供することにある。【解決手段】基板14と、光半導体素子10と、光半導体素子10が発光する光を反射させる反射体12とを有する半導体発光装置1の製造方法であって、電離放射線硬化性樹脂と白色材料と2%重量減少温度が169℃以上の架橋処理剤とが少なくとも含まれている反射体形成用組成物を射出成形する工程と、その射出成形する工程前及び工程後の一方又は両方で電離放射線を照射する工程とを有する方法により、上記課題を解決する。【選択図】図1 |
Author | SAKAI TOSHIYUKI SAKAYORI KATSUYA SASO TOMOKI AMAGAI KEI SUGAYA RYO TAKARABE TOSHIMASA YOSHIDA YASUKI |
Author_xml | – fullname: SUGAYA RYO – fullname: SASO TOMOKI – fullname: SAKAYORI KATSUYA – fullname: SAKAI TOSHIYUKI – fullname: AMAGAI KEI – fullname: TAKARABE TOSHIMASA – fullname: YOSHIDA YASUKI |
BookMark | eNrjYmDJy89L5WS47Osa4uHvouDmH6Tg6-gX6uboHBIa5OnnrhDs6uvp7O_nEuocApTz8XT3CFEACoWEgCRdXMM8nV11FHDqdvb3DfD3c_ULActRZlaQq5uPK0injoKjnwvE6GDPEE9_P7BiIPZFUcbDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDE0NjIwNDQwcjYlSBADXMFWW |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | 半導体発光装置の製造方法、半導体発光装置用部品の製造方法、反射体の製造方法及び反射体形成用組成物 |
ExternalDocumentID | JP2015023100A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_JP2015023100A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 13:02:10 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English Japanese |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_JP2015023100A3 |
Notes | Application Number: JP20130148976 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150202&DB=EPODOC&CC=JP&NR=2015023100A |
ParticipantIDs | epo_espacenet_JP2015023100A |
PublicationCentury | 2000 |
PublicationDate | 20150202 |
PublicationDateYYYYMMDD | 2015-02-02 |
PublicationDate_xml | – month: 02 year: 2015 text: 20150202 day: 02 |
PublicationDecade | 2010 |
PublicationYear | 2015 |
RelatedCompanies | DAINIPPON PRINTING CO LTD |
RelatedCompanies_xml | – name: DAINIPPON PRINTING CO LTD |
Score | 3.0858734 |
Snippet | PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light emitting device having a reflector with excellent heat resistance and... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
Title | METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING COMPONENT FOR SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING REFLECTOR, AND COMPOSITION FOR FORMING REFLECTOR |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150202&DB=EPODOC&locale=&CC=JP&NR=2015023100A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwpV3dT8IwEG8QjfqmqFFRsxizJxZldkwfiBlt5yDsI9AR3sg-EzUBIjP-of5DXutQfJAXH5Z0_bX3cM21d9e7K0JXeR7pZmJiLTHMSMP3eq7Fd81MMww9w1HeTKNcJAq7XssJcW9sjCvoZZkLI-uEvsviiCBRCch7Iffr-Y8Ti8rYysV1_ARdswebt6laWseg3YAxr9JOmwU-9YlKSLsXqN6gxIQ329pAm0KPFoX22agj0lLmq2eKvYe2AiA3LfZR5TmqoR2yfHqthrbd8sYbmqXwLQ7Qh8u441MF7DbFtbzQtggPRTCDMhTM9D0aEg5Yv_vocAW6OBcgZaMuYQ3lz9nEdwPfYx6X2P9oDZjdZ2JmQ7E8-kV62BVuMDkYPvfXsEN0aTNOHA24M_lei0kvWOHk7RGqTmfT7Bgp-k0rNZMEm2C_4NgExcIUdWMwzvOWker6CaqvIXS6Fq2jXfEnY6X1M1QtXt-yc1AFivhCLuEn2WqosQ |
link.rule.ids | 230,309,786,891,25594,76906 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwpV1fT8IwEG8QjfimqFHxz2LMnliU2VF9IGa0mxtu3QKd4Y1sY0vUBIjM-EH9QrZ1KD7Iiw9Nmv7ae7jm2rvr3RWAizyPdZQiqKUGijV4q-dactPKNMPQMxjnrXGci0Rhn7adCPaGxrACXha5MLJO6LssjsglKuXyXsjzevbjxCIytnJ-mTzxoemdzTpELa1jrt1wY14l3Y4VBiTAKsadXqjSfokJb7a5BtaRKM8rdKfHrkhLmS3fKfY22Ag5uUmxAyrPcR3U8OLrtTrY9MsXb94thW--Cz58izkBUbjdpvgmjWwTs0gEMygDwcyAkggzjnnuvcMUPsSYAIn16GKrqfy5Ggd-GFCLMon9j1bfsj1LrGwqJiVfpAeucIPJybz5v6btgXPbYtjROHdG33sx6oVLnLzeB9XJdJIdAEW_ao9RmkLE7ReYIK5YIFE3BsI8bxtjXT8EjRWEjlaiZ6DmMN8beS59aIAtgci4af0YVIvXt-yEqwVFciq38xPovKue |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=METHOD+FOR+MANUFACTURING+SEMICONDUCTOR+LIGHT+EMITTING+DEVICE%2C+METHOD+FOR+MANUFACTURING+COMPONENT+FOR+SEMICONDUCTOR+LIGHT+EMITTING+DEVICE%2C+METHOD+FOR+MANUFACTURING+REFLECTOR%2C+AND+COMPOSITION+FOR+FORMING+REFLECTOR&rft.inventor=SUGAYA+RYO&rft.inventor=SASO+TOMOKI&rft.inventor=SAKAYORI+KATSUYA&rft.inventor=SAKAI+TOSHIYUKI&rft.inventor=AMAGAI+KEI&rft.inventor=TAKARABE+TOSHIMASA&rft.inventor=YOSHIDA+YASUKI&rft.date=2015-02-02&rft.externalDBID=A&rft.externalDocID=JP2015023100A |