METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING COMPONENT FOR SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING REFLECTOR, AND COMPOSITION FOR FORMING REFLECTOR

• Main Authors: SUGAYA RYO, SASO TOMOKI, SAKAYORI KATSUYA, SAKAI TOSHIYUKI, AMAGAI KEI, TAKARABE TOSHIMASA, YOSHIDA YASUKI
• Format: Patent
• Language: English; Japanese
• Published: 02.02.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor light emitting device having a reflector with excellent heat resistance and moldability, and a method for manufacturing a component for the semiconductor light emitting device.SOLUTION: A method for manufacturing a semiconductor light emitting device 1 having a substrate 14, an optical semiconductor element 10, and a reflector 12 for reflecting the light emitted from the optical semiconductor element 10, comprises: a step for injection-molding a composition for forming the reflector, which contains at least an ionizing radiation curable resin, a white material, and a crosslinking treatment agent of which 2% weight loss temperature is equal to or more than 169°C; and a step for irradiating with the ionizing radiation one or both of before the step for injection-molding and after the step. The method solves above problems. 【課題】耐熱性と成形性に優れた反射体を備えた半導体発光装置の製造方法及び半導体発光装置用部品の製造方法等を提供することにある。【解決手段】基板１４と、光半導体素子１０と、光半導体素子１０が発光する光を反射させる反射体１２とを有する半導体発光装置１の製造方法であって、電離放射線硬化性樹脂と白色材料と２％重量減少温度が１６９℃以上の架橋処理剤とが少なくとも含まれている反射体形成用組成物を射出成形する工程と、その射出成形する工程前及び工程後の一方又は両方で電離放射線を照射する工程とを有する方法により、上記課題を解決する。【選択図】図１