ELECTROPLATING APPARATUS

• Main Authors: AMAKUSA SEIJI, UCHIDA TOMOYA, TAYA ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 02.02.2015
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

PROBLEM TO BE SOLVED: To provide an electroplating apparatus capable of forming normal plating at a high speed while reducing variation in the film thickness.SOLUTION: An electroplating apparatus 1 comprises: an annular mask 3 which is formed in an annular shape and has a plurality of openings 31; a liquid reserving part 4 arranged opposite to a substrate 2 to be treated in a state where the annular mask 3 is interposed therebetween, and filled with plating solution; and an anode 5 arranged in the liquid reserving part 4. The liquid reserving part 4 has an opening which faces at least part of overlapping part with the substrate 2 to be treated of the annular mask 3. The annular mask 3 is constituted so as to circulate along the annular shape thereof. The contact part with the substrate 2 to be treated of the annular mask 3 is constituted so as to move in synchronization with the substrate 2 to be treated while maintaining a state where the opening 31 overlaps a part 21 to be plated. 【課題】膜厚のばらつきを低減しつつ正常なめっきを高速で形成することができる電気めっき装置を提供すること。【解決手段】電気めっき装置１は、環状に形成されていると共に複数の開口部３１を有する環状マスク３と、環状マスク３を間に介在させた状態で被処理基板２に対向配置されていると共にめっき液が充填される液溜部４と、液溜部４内に配された陽極５と、を備えている。液溜部４は、環状マスク３のうち被処理基板２に重なった部分の少なくとも一部に面して開口している。環状マスク３は、自身の環状形状に沿って周回するよう構成されている。環状マスク３における被処理基板２と接触する部分については、開口部３１が被めっき部２１に重なる状態を保ちながら被処理基板２と同期して移動するよう構成されている。【選択図】図１