LASER CUTTING DEVICE AND LASER CUTTING METHOD

• Main Authors: YAGI YUJI, UCHIDA ISAO, MIZOWAKI AKIRA
• Format: Patent
• Language: English; Japanese
• Published: 29.01.2015
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a laser cutting device which is formed into a structure where a pin support of a work table is not disposed immediately below a material to be cut when the material is cut by a laser and thereby reduces the occurence of quality defects caused by burn of the material.SOLUTION: A laser cutting device of the invention includes: a work table 2; a laser head 1 which is held by the work table 2 and may move in an X direction and a Y direction facing the work table 2; a Y direction LM rail 9; a Y direction driving base 5 which slides on the Y direction LM rail 9 in the Y direction; Y axis driving means which drives the Y direction driving base 5 in the Y direction; an X direction LM rail 7 which is provided on the Y direction driving base 5 in an X axis direction; an X direction driving base 4 which slides on the X direction LM rail 7 in the X direction; X axis driving means which drives the X direction driving base 4 in the X axis direction; and a pin support 3 provided on the X direction driving base 4. 【課題】 本発明は、材料をレーザー切断する際、切断する材料直下にワークテーブルの剣山が配置することがない構成にすることで、材料の焼けおよび焦げによる品質不良の発生を低減することの出来るレーザー切断装置を提供することを目的とする。【課題を解決するための手段】 本発明のレーザー切断装置は、ワークテーブル２と、ワークテーブル２に保持され、ワークテーブル２に対向してＸ方向及びＹ方向に移動可能なレーザーヘッド１と、Ｙ方向ＬＭレール９と、Ｙ方向ＬＭレール９上をＹ方向に摺動するＹ方向駆動ベース５と、Ｙ方向駆動ベース５をＹ方向に駆動するＹ軸用駆動手段と、Ｙ方向駆動ベース５上にＸ軸方向に設けられるＸ方向ＬＭレール７と、Ｘ方向ＬＭレール７上をＸ方向に摺動するＸ方向駆動ベース４と、Ｘ方向駆動ベース４をＸ軸方向に駆動するＸ軸用駆動手段と、Ｘ方向駆動ベース４上に設けられる剣山３とを備える。【選択図】図２