MODULE STRUCTURE

PROBLEM TO BE SOLVED: To provide a module structure capable of improving reliability of a product.SOLUTION: A die pad 2, a pad for a component and a wire pad 4, are provided on a substrate 1. Coating material 5 covers a corner 11 of the die pad 2 or the like. A resin 9 covers the die pad 2 or the li...

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Bibliographic Details
Main Author KAMO YOSHIYUKI
Format Patent
LanguageEnglish
Japanese
Published 22.01.2015
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a module structure capable of improving reliability of a product.SOLUTION: A die pad 2, a pad for a component and a wire pad 4, are provided on a substrate 1. Coating material 5 covers a corner 11 of the die pad 2 or the like. A resin 9 covers the die pad 2 or the like and the coating material 5. Adhesion of the coating material 5 with the die pad or the like, or with the resin 9, is higher than adhesion of the die pad 2 or the like with the resin 9, and a corner 10 of the coating material 5 has a radius of 0.05 to 0.25 nm. 【課題】製品の信頼性を向上させることができるモジュール構造を得る。【解決手段】基板１上にダイパッド２、部品用パッド３、ワイヤパッド４が設けられている。コーティング材５がダイパッド２等の角部１１を覆っている。樹脂９がダイパッド２等とコーティング材５を覆っている。コーティング材５とダイパッド２等及び樹脂９との密着性はダイパッド２等と樹脂９との密着性よりも高い。コーティング材５の角部１０は０．０５〜０．２５ｍｍのアールを有する。【選択図】図５
Bibliography:Application Number: JP20130142657