EPOXY COMPOUND COMPOSITION
PROBLEM TO BE SOLVED: To heighten fire retardant of a resin molding without deteriorating heat resistance and high-temperature reliability.SOLUTION: A resin composition comprises: an epoxy compound composition comprising at least two kinds of epoxy compounds having a phosphazene ring and an epoxy gr...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
22.01.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To heighten fire retardant of a resin molding without deteriorating heat resistance and high-temperature reliability.SOLUTION: A resin composition comprises: an epoxy compound composition comprising at least two kinds of epoxy compounds having a phosphazene ring and an epoxy group which are produced by the reaction of a polyfunctional glycidyl compound, such as glycidyl ether of bisphenol A, with a hydroxy group-containing cyclic phosphazene compound such as a cyclic phosphazene compound in which an aryloxy group and a hydroxyaryloxy group are mixed and substituted; and at least one kind of resin component selected from the group consisting of a thermoplastic resin and a thermosetting resin. The resin composition is excellent in heat resistance, high-temperature reliability and flame retardancy, and can form a resin molding having properties inherent to the resin component. The resin molding can be used as a sealing agent for an electronic component, such as an LSI, and a substrate.
【課題】耐熱性および高温信頼性を損なわずに、樹脂成形体の難燃性を高める。【解決手段】ビスフェノールAのグリシジルエーテルなどの多官能性グリシジル化合物と、アリールオキシ基およびヒドロキシアリールオキシ基が混合置換した環状ホスファゼン化合物などのヒドロキシ基含有環状ホスファゼン化合物との反応により得られる、ホスファゼン環とエポキシ基とを有するエポキシ化合物を少なくとも二種類含むエポキシ化合物組成物と、熱可塑性樹脂および熱硬化性樹脂からなる群から選ばれた少なくとも一種の樹脂成分とを含む樹脂組成物は、耐熱性および高温信頼性とともに難燃性に優れ、樹脂成分による特性を備えた樹脂成形体を形成することができる。この樹脂成形体は、LSI等の電子部品の封止剤や基板等として用いられる。【選択図】なし |
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Bibliography: | Application Number: JP20140213654 |