POLISHING PAD

• Main Authors: KAWABATA KATSUMASA, FUJIMOTO KEIICHIRO, OBARA MOTOYUKI, MIZUNO TAKESHI
• Format: Patent
• Language: English; Japanese
• Published: 22.01.2015
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a polishing pad which prevents complication of work when peeling off and replacing a polishing layer from a surface plate due to remaining adhesive material and which can be easily replaced.SOLUTION: A polishing sheet 2 comprises a sticking surface 20 to be placed on a surface plate P1 and a polishing layer 21 for polishing an object to be polished. The sticking surface of the polishing sheet has waterproofness, and the polishing sheet is stuck on the surface plate by surface tension of a liquid R. The polishing sheet can be easily removed by forming a gap between the sticking surface and the liquid. 【課題】研磨層を定盤から剥がして交換する際、粘着材料が残留し作業が煩雑になることを防止し、容易に交換することができる研磨パッドを提供する。【解決手段】定盤Ｐ１上に配置される貼付面２０及び被研磨物を研磨する研磨層２１を有する研磨シート２において、研磨シートの貼付面が防水性を有するようにし、液体Ｒの表面張力によって研磨シートを定盤上に貼り付けるようにする。取り外すには貼付面と液体との間に隙間を形成することで容易に取り外すことができる。【選択図】図２