OPTICAL MODULE, OPTICAL SCANNER, IMAGE FORMING APPARATUS, AND MANUFACTURING METHOD OF OPTICAL MODULE

• Main Author: HIROI MASAKI
• Format: Patent
• Language: English; Japanese
• Published: 19.01.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CORRECTION OF TYPOGRAPHICAL ERRORS; DEVICES USING STIMULATED EMISSION; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To provide an optical module that can prevent, when a package body and a support are welded to each other, damage to joining materials to prevent the occurrence of sealing defects.SOLUTION: An light source device 400 includes a package 10 on which a surface light emitting laser array chip 40 and a photodiode 60 are mounted, a support that includes a lid 20 supporting, with joining materials therebetween, cover glass 41 transmitting at least a part of light, and a heat conduction member 70 that is brought into contact with both the package 10 and lid 20 when the package body and support are welded to each other. With this configuration, when the package body and support are welded to each other, damage to the joining materials can be prevented so as to prevent the occurrence of sealing defects. 【課題】パッケージ体と保持体とが溶接されるとき、接合材の破損を防止でき、封止不良の発生を防止できる光学モジュールを提供する。【解決手段】 光源装置４００は、面発光レーザアレイチップ４０及びフォトダイオード６０が実装されるパッケージ１０を含むパッケージ体と、光の少なくとも一部を透過させるカバーガラス４１を接合材を介して保持するリッド２０を含む保持体とが溶接されるとき、パッケージ１０及びリッド２０のいずれにも接する熱伝導部材７０を備えている。この場合、パッケージ体と保持体とが溶接されるとき、接合材の破損を防止でき、封止不良の発生を防止できる。【選択図】図１２