RESIN COMPOSITION

• Main Authors: MAEDA MASATOSHI, MASUJIMA MASAHIRO, SAWADA YOSHIHIRO, YAMADAYA TOKUNORI
• Format: Patent
• Language: English; Japanese
• Published: 08.01.2015
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS

PROBLEM TO BE SOLVED: To provide a resin composition suitable for flattening application and sealing application, a flattened substrate which is flattened by the resin composition, a display device and an optical semiconductor device which are sealed by the resin composition, and a method for manufacturing the flattened substrate using the resin composition.SOLUTION: A resin composition contains a cyclic olefin resin, an organic peroxide, a polymer-based surfactant, and a hydrocarbon-based solvent. The polymer-based surfactant has a mass average molecular weight of 10,000-100,000, and an SP value of 8.0-10.0(cal/cm). 【課題】平坦化用途や封止用途に好適な樹脂組成物、その樹脂組成物によって平坦化された平坦化基板、その樹脂組成物によって封止された表示装置及び光半導体装置、並びにその樹脂組成物を用いた平坦化基板の製造方法を提供する。【解決手段】本発明に係る樹脂組成物は、環状オレフィン樹脂と、有機過酸化物と、ポリマー系界面活性剤と、炭化水素系溶媒とを含有し、上記ポリマー系界面活性剤の質量平均分子量が１００００〜１０００００であり、且つ、ＳＰ値が８．０〜１０．０（ｃａｌ／ｃｍ３）１／２である。【選択図】なし