METHOD FOR MANUFACTURING MOLDED BOARD PRODUCT
PROBLEM TO BE SOLVED: To provide a method for manufacturing a molded board product which can stabilize accuracy at the time of polishing an end part of the molded board product.SOLUTION: A method for manufacturing a molded board product includes: a molding step of molding a package tray 20 by pressi...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
08.01.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a method for manufacturing a molded board product which can stabilize accuracy at the time of polishing an end part of the molded board product.SOLUTION: A method for manufacturing a molded board product includes: a molding step of molding a package tray 20 by pressing a pre-board P1 comprising a thermoplastic resin by a pair of molding dies 31, 32 and cutting a peripheral end part P2 of the pre-board P1 by cutting blades 31B, 33A; and a polishing step of polishing an extension part 22 in the package tray 20 by a polishing member 41 after the molding step to chamfer the extension part 22. In the polishing step, the extension part 22 is engaged with a groove part 42 formed in the polishing member 41, and the polishing member 41 is energized to the extension part 22 side by a coil spring 47 compressed from a natural state, thereby forming a pressing state where a polishing surface 42A formed on an inner surface of the groove part 42 presses the extension part 22. The extension part 22 is polished by sliding the polishing surface 42A in the pressing state with respect to the extension part 22.
【課題】ボード成形品の端末部を研磨する際の精度を安定させることが可能なボード成形品の製造方法を提供する。【解決手段】熱可塑性樹脂を含むプレボードP1を一対の成形型31,32によってプレスするとともに、切断刃31B,33AによってプレボードP1の周端部P2を切断することで、パッケージトレイ20を成形する成形工程と、成形工程の後に行われ、パッケージトレイ20における延設部22を研磨部材41によって研磨することで面取りする研磨工程と、を備え、研磨工程では、研磨部材41に形成された溝部42に延設部22を嵌合させるとともに、研磨部材41を自然状態よりも圧縮されたコイルバネ47によって延設部22側に付勢することで、溝部42の内面に設けられた研磨面42Aを延設部22に押し当てた押圧状態とし、押圧状態の研磨面42Aを延設部22に対して摺動させることで、延設部22を研磨することに特徴を有する。【選択図】図5 |
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Bibliography: | Application Number: JP20130128586 |