SUBSTRATE PROCESSING APPARATUS, SUBSTRATE DETECTING METHOD AND STORAGE MEDIUM
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of reducing a time required for a recovery operation of a wafer.SOLUTION: A substrate processing apparatus 10 includes a placing base 40 for storing a plurality of wafers W in predetermined receiving positions P-P, respectivel...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
05.01.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of reducing a time required for a recovery operation of a wafer.SOLUTION: A substrate processing apparatus 10 includes a placing base 40 for storing a plurality of wafers W in predetermined receiving positions P-P, respectively, and a wafer transporting arm 31 for receiving the wafer W located in each of the receiving positions P-Pof the placing base 40 and transporting the wafer W to the outside of the placing base 40. The wafer transporting arm 31 is provided with a pressure meter 56 for detecting whether or not the wafer exists on the wafer transporting arm 31. A control unit 80 allows the wafer transporting arm 31 to move to one of the receiving positions P-Pof the placing base 40, determines whether the wafer W exists at one of the receiving positions P-Pon the basis of a detection signal from the pressure meter 56, and when determining that the wafer W does not exist at one of the receiving positions P-P, allows the wafer transporting arm 31 to pass through one of the receiving positions P-Pto move to the next receiving position.
【課題】ウエハの回収動作に要する時間を短縮することが可能な基板処理装置を提供する。【解決手段】基板処理装置10は、複数のウエハWをそれぞれ所定の受取位置P1〜P10に収容する置き台40と、置き台40の各受取位置P1〜P10にあるウエハWを受け取るとともに、当該ウエハWを置き台40の外方へ搬送するウエハ搬送アーム31とを備えている。ウエハ搬送アーム31には、ウエハ搬送アーム31上にウエハWが存在するか否かを検知する圧力計56が設けられている。制御部80は、ウエハ搬送アーム31を置き台40の一の受取位置P1〜P10に移動させ、圧力計56からの検知信号に基づいて当該受取位置P1〜P10にウエハWが存在するかを判断し、当該受取位置にウエハWが存在しないと判断した場合、ウエハ搬送アーム31を当該受取位置を通過して次の受取位置まで移動させる。【選択図】図2 |
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Bibliography: | Application Number: JP20130125909 |