RESIN LAMINATE AND ELECTRONIC APPLIANCE

• Main Authors: DEJIMA HIROHISA, TAKAHASHI TOYOMASA
• Format: Patent
• Language: English; Japanese
• Published: 05.01.2015
• Subjects: LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a transparent resin laminate having a high surface hardness and excellent abrasion resistance and excoriation resistance and unaccompanied by practical problems such as warping and cracking at the time of curing and cracking at the time of bending.SOLUTION: The provided resin laminate is a resin laminate obtained by forming, as cured resin coating film layers on at least one surface of a transparent plastic substrate, a first resin layer and a second resin layer. The second resin layer is formed atop the first resin layer and the first resin layer includes a radical-polymerizable resin and a bifunctional or higher epoxy resin. The weight compositional ratio of the radical-polymerizable resin and epoxy resin is 2 : 8 to 8 : 2. The first resin layer includes a photopolymerization initiator. The second resin layer includes the radical-polymerizable resin. The thickness of the first resin layer is 12-60 μm, and the thickness of the second resin layer is 1-20 μm. 【課題】表面硬度が高く、耐摩耗性、耐擦傷性に優れ、硬化時の反りやクラック、曲げ時のクラックなどが実用的に問題ない透明樹脂積層体を提供する。【解決手段】透明プラスチック基材の少なくとも一方の面上に硬化樹脂被膜層である第１樹脂層と、第２樹脂層とを形成した樹脂積層体であって、前記第１樹脂層の上に、第２樹脂層が形成され、前記第１樹脂層が、ラジカル重合型樹脂と２官能以上のエポキシ樹脂を含むことを特徴とする樹脂積層体である。ラジカル重合型樹脂とエポキシ樹脂の重量組成比が２：８〜８：２である。第一樹脂層に光重合開始剤を含む。第２樹脂層はラジカル重合型樹脂を含む。第一樹脂層の厚さが１２〜６０μｍであり、第２樹脂層の厚さが１〜２０μｍである。【選択図】なし