ELECTRONIC COMPONENT MOUNTING MACHINE
PROBLEM TO BE SOLVED: To provide a technology for easily performing trial mounting of an electronic component with no mounting result.SOLUTION: An electronic component mounting machine comprises: a feeder for supplying an electronic component; a mounting head for conveying the electronic component s...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
25.12.2014
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a technology for easily performing trial mounting of an electronic component with no mounting result.SOLUTION: An electronic component mounting machine comprises: a feeder for supplying an electronic component; a mounting head for conveying the electronic component supplied by the feeder to a circuit board and mounting the electronic component; and a control device for controlling the mounting head on the basis of a production program and result data. The production program describes a plurality of electronic components to be mounted on the circuit boards and positions on the circuit board to mount the electronic components, and result information is information capable of discriminating the presence/absence of a mounting result for each electronic component. The control device is configured to control the mounting head so as to omit the mounting of an electronic component with the mounting result among the plurality of electronic components described in the production program.
【課題】 装着実績のない電子部品の試験的な装着を容易に行うための技術を提供する。【解決手段】 電子部品を供給するフィーダと、フィーダが供給する電子部品を回路基板へ搬送して装着する装着ヘッドと、生産プログラムと実績データとに基づいて、装着ヘッドを制御する制御装置を備えている。ここで、生産プログラムは、回路基板に装着すべき複数の電子部品と、それらの電子部品を装着すべき回路基板上の位置とを記述するものであり、実績情報は、各々の電子部品について装着実績の有無を区別し得る情報である。そして、制御装置は、生産プログラムに記述された複数の電子部品のうち、装着実績のある電子部品の装着が省略されるように、装着ヘッドを制御可能に構成されている。【選択図】図6 |
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Bibliography: | Application Number: JP20130122829 |