INK FOR SOLDER RESIST AND HARDENED MATERIAL THEREOF, AND PRINTED WIRING BOARD ARRANGED BY USING THE HARDENED MATERIAL

• Main Authors: TERAMINE KENICHI, YOSHIDA YASUNARI, KUNO TOSHIMITSU, AZEYANAGI YASUHIRO, HIROTA TAKESHI, MIURA HIDEKI, SUGIMOTO TAKASHI, MATSUOKA TOMIZO
• Format: Patent
• Language: English; Japanese
• Published: 15.12.2014
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS THEREFOR; WOODSTAINS

PROBLEM TO BE SOLVED: To provide: ink for solder resist which can be preferably used as a solder resist and is superior from the viewpoint of a high thermal conductivity and a heat dissipation property; a hardened material thereof; and a printed wiring board arranged by use such ink.SOLUTION: Ink fo...