INK FOR SOLDER RESIST AND HARDENED MATERIAL THEREOF, AND PRINTED WIRING BOARD ARRANGED BY USING THE HARDENED MATERIAL

• Main Authors: TERAMINE KENICHI, YOSHIDA YASUNARI, KUNO TOSHIMITSU, AZEYANAGI YASUHIRO, HIROTA TAKESHI, MIURA HIDEKI, SUGIMOTO TAKASHI, MATSUOKA TOMIZO
• Format: Patent
• Language: English; Japanese
• Published: 15.12.2014
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS THEREFOR; WOODSTAINS

PROBLEM TO BE SOLVED: To provide: ink for solder resist which can be preferably used as a solder resist and is superior from the viewpoint of a high thermal conductivity and a heat dissipation property; a hardened material thereof; and a printed wiring board arranged by use such ink.SOLUTION: Ink for solder resist comprises: granular inorganic filler; and a thermosetting resin composition. The inorganic filler accounts for 50-80 vol.%. The inorganic filler includes aluminum nitride subjected to waterproofing and includes, by weight percentage, 50-70 wt.% of particles having a median diameter of 10-25 μm, 20-32 wt.% of particles having a median diameter of 2-8 μm, and 3-25 wt.% of particles having a median diameter of 0.1-2 μm. Thus, ink for solder resist superior from the viewpoint of a high thermal conductivity and a heat dissipation property, a hardened material thereof, and a printed wiring board arranged by use such ink can be provided. 【課題】ソルダーレジストとして好適に用いることができ、かつ高熱伝導性・放熱性に優れたソルダーレジスト用インキ、及びその硬化物並びにそれを用いたプリント配線板を提供する。【解決手段】粒状の無機充填材と熱硬化性樹脂組成物とを含むソルダーレジスト用インキであって、無機充填材の割合が５０ｖｏｌ％〜８０ｖｏｌ％であると共に、無機充填材は、メディアン径が１０μｍ〜２５μｍの粒子の重量割合が５０ｗｔ％〜７０ｗｔ％、メディアン径が２μｍ〜８μｍの粒子の重量割合が２０ｗｔ％〜３２ｗｔ％、及びメディアン径が０．１μｍ〜２μｍの粒子の重量割合が３ｗｔ％〜２５ｗｔ％であり、かつ耐水処理を施した窒化アルミニウムであることを特徴とする高熱伝導性・放熱性に優れたソルダーレジスト用インキ、及びその硬化物並びにそれを用いたプリント配線板が提供される。【選択図】図１