PHOTOSENSITIVE COMPOSITION

• Main Authors: NAKAYASHIKI AKIKAZU, SHIMIZU MASAAKI, MAEDA YOSUKE, NAKATA YUYA
• Format: Patent
• Language: English; Japanese
• Published: 11.12.2014
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a photosensitive composition whose cured product has an excellent curing shrinkage property and a high refractive index.SOLUTION: A photosensitive composition comprises an adduct of an epoxy compound represented by formula (I) and an unsaturated monobasic acid, an inorganic compound, a crosslinking agent, a photopolymerization initiator and a solvent, where M represents one of formulas (II-1)-(II-4). 【課題】硬化物が硬化収縮性に優れ、高い屈折率を有する感光性組成物を提供する。【解決手段】式（Ｉ）で表されるエポキシ化合物と不飽和一塩基酸との付加物、無機化合物、架橋剤、光重合開始剤および溶媒を含有する感光性組成物。（式中、Ｍは式（ＩＩ−１）〜（ＩＩ−４）のいずれかを表す。）【選択図】なし