SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To improve reliability and performance of a semiconductor device having a capacitative element.SOLUTION: In a semiconductor device, a lower electrode LE of a capacitative element C1 is provided in any wiring layer among a plurality of wiring layers formed on a semiconductor sub...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
08.12.2014
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To improve reliability and performance of a semiconductor device having a capacitative element.SOLUTION: In a semiconductor device, a lower electrode LE of a capacitative element C1 is provided in any wiring layer among a plurality of wiring layers formed on a semiconductor substrate, an upper electrode UE of the capacitative element C1 is provided above the lower electrode LE and in a wiring layer two layers above the wiring layer where the lower electrode LE is formed, and a floating electrode FE located between the lower electrode LE and the upper electrode UE is provided in a wiring layer one layer above the wiring layer where the lower electrode LE is formed.
【課題】容量素子を有する半導体装置の信頼性や性能を向上させる。【解決手段】半導体基板上に形成した複数の配線層のうちのいずれかの配線層に、容量素子C1の下部電極LEを設け、下部電極LEが形成された配線層よりも2つ上層の配線層において、下部電極LEの上方に容量素子C1の上部電極UEを設ける。そして、下部電極LEが形成された配線層よりも1つ上層の配線層において、下部電極LEと上部電極UEとの間に位置する浮遊電極FEを設ける。【選択図】図8 |
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Bibliography: | Application Number: JP20130107381 |