WIRING BOARD AND SEMICONDUCTOR DEVICE

• Main Authors: MUTSUKAWA AKIO, TANAKA MASATO, KANEDA WATARU, SHIMIZU NORIYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 04.12.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a wiring board which can achieve high density of a wiring layer.SOLUTION: A wiring board comprises: a core layer 11; first insulation layers 13, 15, and 17 laminated on a first surface side of the core layer and a plurality of second insulation layers 32, 34, and 36 laminated on a top face of the first insulation layers; and third insulation layers 23, 25, 27 laminated on the other surface side of the core layer and a solder resist layer 40 laminated on the third insulation layers, in which the same number of first insulation layers and third insulation layers are formed on the one surface side and the other surface side of the core layer, respectively. On the one surface side of the core layer, first wiring layers and the first insulation layers are laminated, and second wiring layers and the second insulating layers are alternately laminated on the top face of the first insulation layers. On the other surface side of the core layer, third wiring layers and the third insulation layers are formed. The first insulation layers and the third insulation layers are composed of a thermosetting resin, the second insulation layer is composed of a photosensitive resin, and the wiring density of the second wiring layers are formed higher than the wiring density of the first wiring layers. 【課題】配線層の高密度化を実現可能な配線基板を提供する。【解決手段】コア層１１と、前記コア層の一面側に積層された第１絶縁層１３，１５，１７及び該第１絶縁層の上面に積層された複数の第２絶縁層３２，３４，３６と、前記コア層の他面側に積層された第３絶縁層２３，２５，２７及び該第３絶縁層上に積層されたソルダーレジスト層４０と、を有し、前記第１絶縁層と前記第３絶縁層とは、それぞれ前記コア層の一面側と他面側とに同数層形成されており、前記コア層の一面側には第１配線層と前記第１絶縁層とが積層され、前記第１絶縁層の上面には第２配線層と前記第２絶縁層とが交互に積層され、前記コア層の他面側には第３配線層と前記第３絶縁層とが形成され、前記第１絶縁層及び前記第３絶縁層は熱硬化性樹脂からなり、前記第２絶縁層は感光性樹脂からなり、前記第２配線層は、前記第１配線層よりも配線密度が高く形成されている。【選択図】図１