WIRING BOARD

• Main Authors: MUTSUKAWA AKIO, TANAKA MASATO, KANEDA WATARU, SHIMIZU NORIYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 04.12.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a wiring board which can achieve high density of a wiring layer.SOLUTION: A wiring board 1 comprises a core layer 11, a first insulation layer and a second insulation layer which are laminated on one surface side of the core layer, and a third insulation layer and a...