BONDING METHOD, BONDING DEVICE, AND BONDING SYSTEM

• Main Author: OKAWA OSAMU
• Format: Patent
• Language: English; Japanese
• Published: 04.12.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent natrium from being deposited from a glass substrate.SOLUTION: A bonding method according to an embodiment includes a first holding step, a second holding step, a pressure reducing step, and a bonding step. The first holding step holds a processed substrate. The second holding step holds a glass substrate by placement or electrostatic attraction. The pressure reducing step reduces the pressure in the chamber in which the processed substrate and the glass substrate are stored. The bonding step bonds the processed substrate and the glass substrate by bringing the processed substrate into contact with the glass substrate and pressurizing the processed substrate and the glass substrate. The second holding step switches holding of the glass substrate from holding by placement to holding by electrostatic attraction at least during a prescribed period including a pressure change timing at which the pressure in the chamber changes in the pressure reducing step or during a prescribed period including a pressurizing timing at which the processed substrate and the glass substrate are pressurized in the bonding step. 【課題】ガラス基板からのナトリウムの析出を抑制すること。【解決手段】実施形態に係る接合方法は、第１保持工程と、第２保持工程と、減圧工程と、接合工程とを含む。第１保持工程は、被処理基板を保持する。第２保持工程は、ガラス基板を載置または静電吸着により保持する。減圧工程は、被処理基板およびガラス基板が収容されるチャンバ内を減圧する。接合工程は、被処理基板とガラス基板とを接触させて加圧することにより、被処理基板とガラス基板とを接合する。第２保持工程は、減圧工程でチャンバ内の圧力が変化する圧力変化タイミングを含む所定期間および接合工程で被処理基板とガラス基板とを加圧する加圧タイミングを含む所定期間の少なくともいずれかにおいて、ガラス基板の保持を載置による保持から静電吸着による保持に切り替える。【選択図】図７