SUCTION TOOL AND COMPONENT MOUNTING APPARATUS

• Main Authors: KOSHIO TEPPEI, ISHIKAWA TAKATOSHI, SONODA TOMOYUKI
• Format: Patent
• Language: English; Japanese
• Published: 20.11.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HAND TOOLS; MANIPULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PORTABLE POWER-DRIVEN TOOLS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a suction tool and a component mounting apparatus capable of safely sucking an electronic component having a specific part including a wiring on the surface without giving any damage or deformation.SOLUTION: A suction tool 30 is attached to a head unit (a reversing head 16 and a mounting head 17) for transferring a component provided to a component mounting apparatus 1 to suck an electronic component 3 which has diaphragm 3D as a specific portion having a wiring on the surface thereof as a suction target. The suction tool 30 includes: a suction opening 34 formed being opened in a contact part 33 that comes into contact with the electronic component 3; and a communication path 36 that communicates between a concave 35 and an external part of the suction tool 30 in a state that the concave 35 which is formed in a position facing the diaphragm 3D in a vertical direction and the contact part 33 are in contact with the electronic component 3. 【課題】配線された特定部分を表面に有する電子部品にダメージを与えたり変形等させたりすることなくその電子部品を安全に吸着することができる吸着ツール及び部品実装装置を提供することを目的とする。【解決手段】部品実装装置１が備える部品移動用のヘッド部（反転ヘッド１６及び装着ヘッド１７）に取付けられ、配線された特定部分であるダイヤフラム３Ｄを表面に有する電子部品３を吸着対象として吸着する吸着ツール３０において、電子部品３と接触する接触部分３３に開口して設けられた吸引開口３４、接触部分３３を電子部品３に接触させた状態でダイヤフラム３Ｄと上下に対向する位置に設けられた凹部３５及び接触部分３３を電子部品３に接触させた状態で凹部３５を吸着ツール３０の外部と連通させる連通路３６を備える。【選択図】図４