CURRENT APPLICATION DEVICE

• Main Authors: KAMBARA MASAO, AKAHORI SHIGETO
• Format: Patent
• Language: English; Japanese
• Published: 20.11.2014
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

PROBLEM TO BE SOLVED: To provide a current application device configured so that a contact electrode is broken down first when large current is applied at abnormal time.SOLUTION: A probe device 1 applies a current to a power semiconductor 100 by connecting in series a contact body 2 contacting a surface 100f of the power semiconductor 100 and applying a current and a pressing body assembly 3 pressing the contact body 2. The probe device 1 is configured so that contact body electric power I*Rapplied to the contact body 2 is higher than withstand electric power Wwhen pressure body electric power I*Ris applied to the pressure body assembly 3 lower than withstand electric power W. 【課題】異常時の大電流が印加された場合にコンタクト電極が先に破壊される電流印加装置を提供する。【解決手段】パワー半導体１００の表面１００ｆと接触して電流を印加する接触体２と、接触体２を押圧する押圧体アッセンブリ３と、を直列に接続してパワー半導体１００に電流を印加するプローブ装置１であって、押圧体アッセンブリ３に印加される押圧体電力Ｉ２・Ｒ１が耐電力Ｗ１よりも小さいときに、接触体２に印加される接触体電力Ｉ２・Ｒ２が耐電力Ｗ２よりも大きくなるように構成された。【選択図】図４