CURABLE RESIN COMPOSITION AND SEALING MATERIAL

• Main Authors: KAMATA SHUSUKE, SUGIOKA TAKAHISA, YAO TOMOYUKI, FUJIBAYASHI TERUHISA, WADA TAKAAKI, KONOSU OSAMU
• Format: Patent
• Language: English; Japanese
• Published: 20.11.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a curable resin composition which has high heat resistance, is excellent in flexibility and mechanical strength, and can be suitably used even for a semiconductor sealing material having high heat resistance.SOLUTION: The curable resin composition contains an epoxy resin and a curing agent. The curing agent contains a phenolic resin and an aromatic amine compound. The curable resin composition is obtained by a production method including the steps of: mixing a phenolic resin and an aromatic amine compound to obtain a mixture; and mixing the mixture and an epoxy resin. 【課題】 高い耐熱性を有するとともに、柔軟性や機械強度にも優れ、高耐熱性を有する半導体の封止材にも好適に用いることができる硬化性樹脂組成物を提供する。【解決手段】 エポキシ樹脂、及び、硬化剤を含む硬化性樹脂組成物であって、該硬化剤は、フェノール樹脂と芳香族アミン化合物とを含み、該硬化性樹脂組成物は、フェノール樹脂と芳香族アミン化合物とを混合して混合物を得る工程と、該混合物とエポキシ樹脂とを混合する工程とを含む製造方法により得られることを特徴とする硬化性樹脂組成物。【選択図】なし