PACKAGE FOR ACCOMMODATING OPTICAL SEMICONDUCTOR ELEMENT AND MOUNTING STRUCTURE PROVIDED THEREWITH

• Main Authors: SATAKE TAKEO, SAKUMOTO DAISUKE
• Format: Patent
• Language: English; Japanese
• Published: 17.11.2014
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a package for accommodating an optical semiconductor element capable of suppressing a positional deviation of a ferrule and capable of improving optical connectivity between the optical semiconductor element and the ferrule.SOLUTION: A package 3 for accommodating an optical semiconductor element comprises a circuit board 31 having a principal surface, a frame body 32 disposed on the principal surface of the circuit board 31 and having a side part 321 in which a through-hole is formed, a ferrule 33 disposed on the inside and outside of the frame body 32 through the through-hole of the frame body 32, and a holding member 34 disposed on a side part 321 on the outside of the frame body 32 and having a holding hole for holding the ferrule 33. The side part 31 has a notch C extending from an inner surface of the through-hole to a side part 321 on the outside. The holding member 34 is joined to the notch C via a joining member, and at least part of the inner surface of the notch C is apart from the holding member 34. 【課題】フェルールの位置ずれを抑制することができ、光半導体素子およびフェルールの光接続性を向上させることが可能な光半導体素子収納用パッケージを提供する。【解決手段】光半導体素子収納用パッケージ３は、主面を有する基板31と、基板31の主面上に配置され、貫通孔が形成された側部321を有する枠体32と、枠体32の貫通孔を通って枠体32の内側および外側に配置されたフェルール33と、枠体32の外側における側部321上に配置され、フェルール33を保持する保持孔を有する保持部材34とを備え、側部31は、貫通孔の内面から外側における側部321上にかけて切欠き部Ｃを有しており、保持部材34は接合部材を介して切欠き部Ｃに接合されているとともに、切欠き部Ｃの内面の少なくとも一部は保持部材34から離れていることを特徴とする。【選択図】図１