POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE

• Main Authors: IKEDA TAKUJI, NAKAHARA TAKURO
• Format: Patent
• Language: English; Japanese
• Published: 13.11.2014
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is capable of forming a positive pattern with high sensitivity and high resolution and exhibits sufficient strong alkaline aqueous solution resistance, heat resistance, and mechanical characteristics when used in applications such as a surface protective film or an interlayer insulating film as a cured film.SOLUTION: The positive photosensitive resin composition contains: a hydroxystyrene resin (A); a phenol resin (B) obtained by reacting a phenol compound represented by general formula (1) with an aromatic aldehyde compound in the presence of an acid catalyst; a photoacid generator (C); and a solvent (D). (In the formula, Rrepresents an organic group selected from C1-C20 alkyl and alkoxy groups, and p is an integer from 1 to 3 inclusive.) 【課題】高感度かつ高解像度にてポジ型パターンの形成が可能であり、硬化膜として、表面保護膜、層間絶縁膜などの用途に用いる場合、十分な強アルカリ水溶液耐性、耐熱性、機械特性を有する感光性樹脂組成物を提供する。【解決手段】ヒドロキシスチレン樹脂（Ａ）と、下記一般式（１）で表されるフェノール化合物と芳香族アルデヒド化合物を酸触媒下で反応させて得られるフェノール樹脂（Ｂ）と、光酸発生剤（Ｃ）と、溶剤（Ｄ）と、を含むポジ型感光性樹脂組成物。（式中Ｒ1は炭素数１以上２０以下のアルキル基及びアルコキシ基から選ばれる有機基を示し、ｐは１以上３以下の整数である。）【選択図】なし