ELECTRONIC APPARATUS
PROBLEM TO BE SOLVED: To inhibit increase of a load applied to a substrate when the cooling efficiency is improved.SOLUTION: An electronic apparatus according to one embodiment includes: a housing provided with an exhaust port; a circuit board device having a substrate provided with a first surface...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
06.11.2014
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To inhibit increase of a load applied to a substrate when the cooling efficiency is improved.SOLUTION: An electronic apparatus according to one embodiment includes: a housing provided with an exhaust port; a circuit board device having a substrate provided with a first surface and a second surface; a fan provided with a discharge port; a first wall part having a first member and a second member, which is attached to the first member, contacts with the circuit board device, and has rigidity lower than the first member, and forming a first ventilation flue; a second wall part which elastically contacts with the circuit board device, is disposed so as to overlap with the first wall part sandwiching the circuit board device therebetween, and forms a second ventilation flue; and a wall unit having the first wall part and a member, which is attached to an inner surface of the housing. The first member is attached to the inner surface of the housing by the member, and the first ventilation flue is provided between the member and the substrate. One of a first width of a first contact surface of the first wall part and a second width of a second contact surface of the second wall part is wider than the other of the first width and the second width.
【課題】冷却効率の向上を図る上で、基板にかかる負荷が増大することを抑制する。【解決手段】実施形態に係る電子機器は、排気口が設けられた筐体と、第1面および第2面が設けられた基板を有した回路基板装置と、吐出口が設けられたファンと、第1部材および前記第1部材に取り付けられて前記回路基板装置に当接し剛性が前記第1部材よりも低い第2部材を有し、第1通風路を構成した第1壁部と、前記回路基板装置に弾性的に当接し且つ前記回路基板装置を挟んで前記第1壁部に重ねて配置され、第2通風路を構成した第2壁部と、前記第1壁部と部材とを有し、前記部材が前記筐体の内面に取り付けられた壁ユニットと、を備え、前記第1部材は、前記部材によって前記筐体の内面に取り付けられ、前記部材と前記基板との間に前記第1通風路が設けられ、前記第1壁部の第1当接面の第1幅と、前記第2壁部の第2当接面の第2幅とは、一方が他方よりも広い。【選択図】図9 |
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Bibliography: | Application Number: JP20140116191 |