METAL COMPOUND IN NON-BROMINATED FRAME RETARDANT EPOXY RESIN
PROBLEM TO BE SOLVED: To provide an epoxy composition having a stabilizer containing a metal-containing compound useful for a laminate for electricity, and to provide an epoxy resin having excellent thermal stability at 230-260°C while still keeping toughness and workability, even when a temperature...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
06.11.2014
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide an epoxy composition having a stabilizer containing a metal-containing compound useful for a laminate for electricity, and to provide an epoxy resin having excellent thermal stability at 230-260°C while still keeping toughness and workability, even when a temperature to which the laminate for the electricity is exposed rises by approximately 20-40°C and becomes 230-260°C due to restriction of a lead-free solder.SOLUTION: A composition contains (a) an epoxy resin, (b) a curing agent, (c) 0.1-20 wt.% of a stabilizer containing a metal-containing compound (the metal-containing compound contains a metal selected from group 11 to group 13 metals and a combination thereof), and contains a non-halogen frame retardant.
【課題】電気用積層物において有用な金属含有化合物を含む安定剤を有するエポキシ組成物に関する。無鉛はんだ規制の出現により、電気用積層物が曝される温度が約20℃〜40℃上がって、230℃〜260℃になっている。従って、靭性及び加工性を依然として維持しながら、前記温度での熱安定性の良好なエポキシ樹脂の提供。【解決手段】a)エポキシ樹脂、b)硬化剤、及び、c)金属含有化合物を含む安定剤(前記金属含有化合物は、第11族〜第13族の金属及びそれらの組合せから選択される金属を含む)を0.1〜20重量%含む組成物であって、非ハロゲン系難燃剤を含有する組成物。【選択図】なし |
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Bibliography: | Application Number: JP20140136796 |