MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

• Main Authors: MATSUURA TAKAO, IMURA KENICHI, TSUCHIYA KOJI, HASHIZUME TAKANORI, SUZUKI KAZUNARI, MIWA TAKASHI, ICHITANI MASAHIRO, SUZUKI MASAYUKI, TAKAHASHI NORIYUKI, NISHIDA TAKAFUMI
• Format: Patent
• Language: English; Japanese
• Published: 30.10.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: In a semiconductor device 1, a semiconductor chip 8 mounted on a major surface of a package substrate 2 is sealed by a sealing member 11. On the major surface and a rear surface of the package substrate 2, wiring conductor patterns 4 are disposed and dummy conductor patterns 4 are also disposed in regions where the wiring conductor patterns 4 are not formed. Increasing the density of the conductor patterns 4 in the package substrate 2 in the above described manner reduces warpage and swell of the package substrate 2 which are caused by thermal treatment in the manufacturing processes of the semiconductor device 1. 【課題】半導体装置の信頼性を向上させる。【解決手段】パッケージ基板２の主面上に実装された半導体チップ８を封止部材１１によって封止した構成を持つ半導体装置１において、パッケージ基板２の主面および裏面に、配線用の導体パターン４を配置した他に、その配線用の導体パターン４が配置されていない領域にダミー用の導体パターン４とを配置した。このようにパッケージ基板２における導体パターン４の密度を高めることにより、半導体装置１の製造工程中の熱処理によるパッケージ基板２の反りやうねり等を低減することができる。【選択図】図２