ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
PROBLEM TO BE SOLVED: To provide an electronic component which allows for enhancement of the yield, and to provide a manufacturing method therefor.SOLUTION: A core 12 comprises: a planar bottom 12a; and a columnar winding core 12b projecting upward from the upper surface of the bottom 12a. A winding...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
27.10.2014
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide an electronic component which allows for enhancement of the yield, and to provide a manufacturing method therefor.SOLUTION: A core 12 comprises: a planar bottom 12a; and a columnar winding core 12b projecting upward from the upper surface of the bottom 12a. A winding 14 is wound around the winding core 12b, and the end thereof is pulled out to the surface of the bottom 12a. In the winding 14, the portion pulled out to the surface of the bottom 12a is dented into the surface of the bottom.
【課題】歩留まりを向上させることができる電子部品及びその製造方法を提供することである。【解決手段】コア12は、平板状の底部12a、及び、該底部12aの上面から上方に突出する柱状の巻芯部12bを含む。巻線14は、巻芯部12bに巻きつけられていると共に、その端部が底部12aの底面に引き出されている。巻線14において底部12aの底面に引き出されている部分は、該底面に減り込んでいる。【選択図】図2 |
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Bibliography: | Application Number: JP20130081033 |