PUSH-UP STAGE OF PUSH-UP DEVICE

PROBLEM TO BE SOLVED: To provide a push-up stage of a push-up device capable of clearly recognizing dicing lines of a wafer sheet, and reliably picking up electronic components from the wafer sheet even when the electronic components are small.SOLUTION: A push-up device includes a push-up stage 1 wh...

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Bibliographic Details
Main Author HARA YOSHIAKI
Format Patent
LanguageEnglish
Japanese
Published 16.10.2014
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Summary:PROBLEM TO BE SOLVED: To provide a push-up stage of a push-up device capable of clearly recognizing dicing lines of a wafer sheet, and reliably picking up electronic components from the wafer sheet even when the electronic components are small.SOLUTION: A push-up device includes a push-up stage 1 which comes into contact with a wafer sheet on which a plurality of electronic devices are stuck so as to push up the electronic devices with a push-up pin 11 from a rear surface of the wafer sheet. The push-up stage 1 comprises: a main unit 3 which is formed cylindrically; a cap 2 which is transparent to light, and mounted at the top of the main unit 3 in a removable manner; and an illumination section 4 which is mounted below the cap 2, and illuminates the plurality of electronic devices from the rear side of the wafer sheet. The cap 2 comprises a push-up hole 21 where the push-up pin 11 is inserted through. The main unit 3 allows the push-up pin 11 to penetrate therein, and has a step which does not interfere with the push-up pin 11 inside the main unit 3. The illumination section 4 is arranged on the step inside the main unit 3 so as to face the plurality of electronic devices. 【課題】ウエハシートのダイシングラインを明確に認識でき、小型の電子部品でもウエハシートからの確実なピックアップを可能とするウエハシートの突上げ装置の突上げステージを提供する。【解決手段】突上げステージ1は、複数の電子部品が表面に貼着したウエハシートに当接してウエハシートの裏面から突上げピン11により電子部品を突き上げる突上げ装置に用いる突上げステージ1であって、筒状の本体部3と、本体部3の上端に着脱自在に取り付けられ、透光性を有するキャップ部2と、キャップ部2の下方に設けられ、ウエハシートの裏面側から複数の電子部品を照らす照光部4と、を備える。キャップ部2は、突上げピン11を貫通させる突上げ穴21を備える。本体部3は、内部に突上げピン11を貫通させ、本体部3内部に突上げピン11と干渉しない段部が形成されている。照光部4は、複数の電子部品に向けて本体部3内部の段部に設けられている。【選択図】図2
Bibliography:Application Number: JP20140115716