SUBSTRATE HEATING APPARATUS AND SOLDERING APPARATUS

• Main Authors: OSHIMIZU KAZUNORI, HASHIMOTO NOBORU, MUKAI NAOTO
• Format: Patent
• Language: English; Japanese
• Published: 16.10.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a pre-heat apparatus capable of suppressing consumption power and surely raising the temperature of a substrate.SOLUTION: A pre-heat apparatus 1A has a heater 2 for heating a substrate 11. The pre-heat apparatus 1A raises the output of the heater 2 in tandem with a loading operation of the substrate 11 and performs the pre-heat for the substrate 11. The pre-heat apparatus 1A also has a temperature sensor 3 for measuring the temperature of the loaded substrate 11, sets the output of the heater 2 on the basis of the temperature of the substrate 11 and performs the pre-heat for the substrate 11. The pre-heat apparatus 1A lowers the output of the heater 2 in tandem with completion of the pre-heat. 【課題】消費電力を抑えることができ、かつ、基板の温度を確実に上昇させることができるプリヒート装置を提供する。【解決手段】プリヒート装置１Ａは、基板１１を加熱するヒータ２を備える。プリヒート装置１Ａは、基板１１の投入動作に連動してヒータ２の出力を上昇させて、基板１１のプリヒートを行う。また、プリヒート装置１Ａは、投入された基板１１の温度を測定する温度センサ３を備え、基板１１の温度に基づきヒータ２の出力を設定して、基板１１のプリヒートを行う。更に、プリヒート装置１Ａは、プリヒートの完了に連動してヒータ２の出力を低下させる。【選択図】図１