PACKAGE, METHOD, AND APPARATUS

• Main Authors: NITESH NIMKAR, TOONG ERH OOI, BOK ENG CHEAH
• Format: Patent
• Language: English
• Published: 09.10.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a package which can reduce thickness and shorten an interconnection route to a connected object.SOLUTION: An apparatus comprises: a die 130 having a thickness dimension and a die area defined by a length dimension and a width dimension; and a build-up carrier 120 having a carrier area greater than the die area. The build-up carrier comprises: a plurality of alternating layers of conductive material and dielectric material disposed on one side of the die, the dielectric material having a portion of the thickness dimension of the die embedded therein; and a plurality of carrier contact points configured for mounting the build-up carrier on a substrate, the plurality of carrier contact points disposed at a gradation located between the one side of the die and the dielectric material having the thickness dimension of the die embedded therein, where at least one of the plurality of carrier contact points is coupled to at least one of the alternating layers of the conductive material.