COPPER ALLOY STRIP FOR LED LEAD FRAME

• Main Authors: MIWA YOSUKE, MATSUSHITA HIDEKI, NISHIMURA MASAYASU, MASAGO YASUSHI
• Format: Patent
• Language: English
• Published: 06.10.2014
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS; CHEMISTRY; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INSULATORS; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL; METALLURGY; PERFORMING OPERATIONS; PUNCHING METAL; ROLLING OF METAL; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS

PROBLEM TO BE SOLVED: To increase the brightness of an LED package by improving the reflectance of an AG plating reflection film formed on the surface of a lead frame made of a Cu-Fe-based copper alloy strip.SOLUTION: There is provided a Cu-Fe-based copper alloy strip which comprises 0.01 to 0.5 mass% of Fe, 0.01 to 0.20 mass% of P, 0.01 to 1.0 mass% of Zn and 0.01 to 0.15 mass% of Sn and in which the remainder is substantially composed of Cu and inevitable impurities, wherein depressions, which have a surface roughness Ra of 0.2 μm or less, an Rzof 1.2 μm or less and an Rz of 1.5 μm or less in the rolling vertical direction and have an average length in the rolling parallel direction of 2 to 100 μm, an average length in the rolling vertical direction of 1 to 30 μm and a maximum depth along the rolling parallel direction of 400 nm or less, are densely formed on the surface. Ra represents an arithmetic average roughness, Rzrepresents a ten-point average roughness and Rz represents a maximum height roughness.