MULTI-LAYER HEAT INSULATOR

PROBLEM TO BE SOLVED: To provide a multi-layer heat insulator capable of securing preferable electric conduction between layers and capable of being attached to and detached from a heat control target easily in a multi-layer heat insulator to be mounted on an outer face of a satellite or the like.SO...

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Bibliographic Details
Main Author MASE YUKI
Format Patent
LanguageEnglish
Published 02.10.2014
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Summary:PROBLEM TO BE SOLVED: To provide a multi-layer heat insulator capable of securing preferable electric conduction between layers and capable of being attached to and detached from a heat control target easily in a multi-layer heat insulator to be mounted on an outer face of a satellite or the like.SOLUTION: Films having conduction on its front and rear faces are used as an outermost layer film 1 and an inner layer film 2 of the multi-layer heat insulator. The laminated outermost layer film 1 and the inner layer film 2 are crimped by a conductive zipper 4 for securing stable conduction to the respective layers of the multi-layer heat insulator. By using the conductive zipper for mounting of the multi-layer heat insulator to a heat control target, grounding function is added to mechanical zipper function to the heat control target.
Bibliography:Application Number: JP20130061694