CIRCUIT MEMBER, CONNECTION STRUCTURE, AND PROCESS OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a circuit member, a connection structure, and process of manufacturing the same, capable of securing connection reliability even when an amount of conductive particles in an anisotropic conductive adhesive is reduced.SOLUTION: The circuit member includes a substrate...

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Bibliographic Details
Main Authors MORIYA TOSHIMITSU, ARIFUKU MASAHIRO, IZAWA HIROYUKI
Format Patent
LanguageEnglish
Published 29.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
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Summary:PROBLEM TO BE SOLVED: To provide a circuit member, a connection structure, and process of manufacturing the same, capable of securing connection reliability even when an amount of conductive particles in an anisotropic conductive adhesive is reduced.SOLUTION: The circuit member includes a substrate and an electrode formed on one surface side of the substrate, and is crimped to another substrate through an anisotropic conductive adhesive containing conductive particles and an adhesive component. At the electrode, pores are formed into which the anisotropic conductive adhesive flows during the crimp.
Bibliography:Application Number: JP20130058307