HEAT SINK AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a heat sink for more improving heat dissipation property by more increasing the heat dissipation area of a porous fin.SOLUTION: The heat sink includes: a spreader 10 as a solid member; and a plurality of fins 20 joined to the spreader 10 as porous members having a pl...

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Bibliographic Details
Main Authors NAKAMURA KENJI, YAMADA HIROSHI, NAKAJIMA HIDEO, IDE TAKUYA, NOMA NAOMUNE, SAITO TOMOYA
Format Patent
LanguageEnglish
Published 25.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a heat sink for more improving heat dissipation property by more increasing the heat dissipation area of a porous fin.SOLUTION: The heat sink includes: a spreader 10 as a solid member; and a plurality of fins 20 joined to the spreader 10 as porous members having a plurality of pores 21h and 22h. Projecting and recessed shape parts 21p and 22p as fine particle peening processing parts are applied to the inner wall surface of each of the plurality of pores 21h and 22h.
Bibliography:Application Number: JP20130053814