WIRE BONDING SYSTEM AND METHOD

PROBLEM TO BE SOLVED: To provide a method of making an electrical connection.SOLUTION: The method includes passing a bond wire through a wire bonding system having a wire polisher and a wire bonding tool. The wire polisher removes contamination from a first portion of the bond wire. A first bond is...

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Bibliographic Details
Main Authors POH LENG EU, YIN KHENG AU, JIA LIN YAP, NAVAS KHAN ORATTI KALANDAR, HUNG YANG LEONG, MOHD RUSLI IBRAHIM, MOHD FAIZAL ZUL-KIFLI
Format Patent
LanguageEnglish
Published 22.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method of making an electrical connection.SOLUTION: The method includes passing a bond wire through a wire bonding system having a wire polisher and a wire bonding tool. The wire polisher removes contamination from a first portion of the bond wire. A first bond is then formed by bonding the first portion of the bond wire to a first contact in such a manner that the bond wire and a first device are electrically connected to each other. A second bond is then formed by bonding a second portion of the bond wire to a second contact in such a manner that the first contact and the second contact are electrically connected to each other.
Bibliography:Application Number: JP20140047363