BRACE FOR BOND WIRE

PROBLEM TO BE SOLVED: To provide a semiconductor device to prevent multiple tiers of bond wires from shorting.SOLUTION: In a semiconductor device having multiple tiers of bond wires (46, 50) extending in a first direction, dummy insulated bond wires (54) extend between the wire tiers in a second dir...

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Bibliographic Details
Main Authors LAI CHENG LAW, WENG FOONG YAP, BOH KID WONG
Format Patent
LanguageEnglish
Published 22.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device to prevent multiple tiers of bond wires from shorting.SOLUTION: In a semiconductor device having multiple tiers of bond wires (46, 50) extending in a first direction, dummy insulated bond wires (54) extend between the wire tiers in a second direction orthogonal to the first direction to support the wires in an upper tier to prevent them from sagging and contacting wires in a lower tier.
Bibliography:Application Number: JP20140045053