CUTTING DEVICE

PROBLEM TO BE SOLVED: To provide a cutting device the upsizing of which can be suppressed, while dealing with the upsizing of a workpiece.SOLUTION: A cutting device 1 includes chuck tables 10a, 10b for holding a workpiece W, cutting means 20a, 20b, and cleaning means 50a, 50b. The cutting means 20a,...

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Bibliographic Details
Main Author OTANI HIDEAKI
Format Patent
LanguageEnglish
Published 22.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a cutting device the upsizing of which can be suppressed, while dealing with the upsizing of a workpiece.SOLUTION: A cutting device 1 includes chuck tables 10a, 10b for holding a workpiece W, cutting means 20a, 20b, and cleaning means 50a, 50b. The cutting means 20a, 20b have the axial direction of a spindle in parallel with the Y axis. The cutting means 20a, 20b are moved up and down freely in the Z axis direction by Z axis moving means, machining fed in the X axis direction by X axis moving means 70a, 70b, and indexing fed in the Y axis direction by Y axis moving means 60a, 60b. The cleaning means 50a cleans the workpiece W held on the chuck table 10a. The cleaning means 50b cleans the workpiece W held on the chuck table 10b.
Bibliography:Application Number: JP20130045988