MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: NAKAYAMA HAJIME, KURIHARA SEIICHI, OGINO HARUO, YAMAGUCHI HIROSHI
• Format: Patent
• Language: English
• Published: 11.09.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide: a multilayer wiring board excellent in a shield effect of a coaxial wire, thereby being suppressed in cross talk and excellent in transmission characteristics; and a method for manufacturing the multilayer wiring board.SOLUTION: In a multilayer wiring board, a coaxial wire having a signal line, an insulation coat, and an outer circumference conductor is positioned in an inner layer, an insulation layer is positioned either further toward the inner layer side or further toward an outer layer side than the coaxial wire, a metal film circuit is positioned via the insulation layer interposed, and the metal film circuit is connected to the outer circumference conductor and the signal line of the coaxial wire. In the multilayer wiring board, a signal line connection part connecting the signal line of the coaxial wire and the metal film circuit includes: a through hole A penetrating through the insulation layer and the outer circumference conductor of the coaxial wire; a coaxial wire from which the outer circumference conductor is removed, in the through hole A; a hole filling resin filled in the through hole A; a through hole B penetrating through the hole filling resin and the signal line of the coaxial wire; and a plating layer positioned on the inner wall of the through hole B. There is also provided a method for manufacturing the multilayer wiring board.