RESIN COMPOSITION FOR SEALING, DISPLAY DEVICE AND OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a resin composition for sealing that is excellent in gas barrier properties and adhesion to a substrate, to provide a display device and an optical semiconductor device each produced by sealing with the resin composition for sealing.SOLUTION: The resin composition fo...

Full description

Saved in:
Bibliographic Details
Main Authors MAEDA MASATOSHI, SAWADA YOSHIHIRO, MASUJIMA MASAHIRO, YAMADAYA TOKUNORI
Format Patent
LanguageEnglish
Published 28.08.2014
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a resin composition for sealing that is excellent in gas barrier properties and adhesion to a substrate, to provide a display device and an optical semiconductor device each produced by sealing with the resin composition for sealing.SOLUTION: The resin composition for sealing comprises a cycloolefin resin, an organic peroxide and a hydrocarbon solvent. The content of the organic peroxide is preferably 0.1-10 pts.mass based on 100 pts.mass of the cycloolefin resin.
Bibliography:Application Number: JP20130027124