POWER MODULE AND MANUFACTURING METHOD OF THE SAME

• Main Authors: TADA KAZUHIRO, BETSUSHIBA NORIYUKI
• Format: Patent
• Language: English
• Published: 21.08.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a power module which is operated at high temperature and achieves high reliability.SOLUTION: A power module includes: a semiconductor element substrate; a semiconductor element fastened to the semiconductor element substrate; an inner frame provided at a peripheral part of the semiconductor element substrate; a first sealing resin which seals the interior of the inner frame; a heat radiation plate which is joined to a rear surface of the semiconductor element substrate; an outer frame provided at a peripheral part of the heat radiation plate; and a second sealing resin which seals the interior of the outer frame so as to cover the first sealing resin, the inner frame, and the semiconductor element substrate. A clearance is formed between the inner frame and the first sealing resin. The clearance is filled with the second sealing resin. An elastic modulus of the second sealing resin is smaller than an elastic modulus of the first sealing resin.