METHOD FOR MANUFACTURING MASK BLANK SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE WITH MULTILAYER REFLECTION FILM, METHOD FOR MANUFACTURING MASK BLANK, AND METHOD FOR MANUFACTURING TRANSFER MASK

PROBLEM TO BE SOLVED: To provide a method for manufacturing a practical mask blank substrate capable of reducing defects of a 30-nm class.SOLUTION: A mask blank substrate is manufactured by a method comprising the steps of: preparing a mask blank substrate with a polished principal surface and surfa...

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Bibliographic Details
Main Authors SHOKI TSUTOMU, YAMADA TAKAYUKI, ORIHARA TOSHIHIKO, NISHIMURA TAKAHITO
Format Patent
LanguageEnglish
Published 21.08.2014
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMISTRY
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
GLASS
HOLOGRAPHY
JOINING GLASS TO GLASS OR OTHER MATERIALS
MATERIALS THEREFOR
METALLURGY
MINERAL OR SLAG WOOL
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
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Summary:PROBLEM TO BE SOLVED: To provide a method for manufacturing a practical mask blank substrate capable of reducing defects of a 30-nm class.SOLUTION: A mask blank substrate is manufactured by a method comprising the steps of: preparing a mask blank substrate with a polished principal surface and surface information including surface form information and position information with respect to the principal surface; detecting a specific portion on the principal surface exceeding a prescribed reference value from the surface form information and identifying the location of the detected specific portion from the position information(specific portion identifying step); and arranging a moving body having a catalyst surface arranged facing the principal surface of the mask blank substrate in the location of the specific portion identified by the specific portion identifying step and locally processing the specific portion by catalyst-referred etching in a state in which a process liquid is interposed between the catalyst surface and the specific portion (local processing step).
Bibliography:Application Number: JP20130017130