NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERNED CURED FILM PRODUCTION METHOD AND ELECTRONIC COMPONENT USING THE SAME

PROBLEM TO BE SOLVED: To provide a resin composition in which the occurrence of residues in an opening of a patterned resin film after development is inhibited, and the adhesion of a formed patterned cured film to a substrate is excellent, and a patterned cured film production method and an electron...

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Bibliographic Details
Main Authors ONO TAKASHI, ENOMOTO TETSUYA, OE TADAYUKI, SUZUKI KEIKO
Format Patent
LanguageEnglish
Published 14.08.2014
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a resin composition in which the occurrence of residues in an opening of a patterned resin film after development is inhibited, and the adhesion of a formed patterned cured film to a substrate is excellent, and a patterned cured film production method and an electronic component using the resin composition.SOLUTION: A resin composition contains following components: (a) a polyimide precursor; (b) a compound that generates radicals by active ray irradiation; (c) a silane coupling compound having a urea bond; and (d) a solvent. A chloride ion concentration in the resin composition is 50 ppm or less.
Bibliography:Application Number: JP20130015208