ADHESIVE SHEET, DICING TAPE INTEGRATED ADHESIVE SHEET, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an adhesive sheet that can prevent breakdown of a circuit on a semiconductor chip in a production process of a semiconductor device.SOLUTION: In order to prevent breakdown of a semiconductor element caused by peeling electrification during pickup, a dicing tape integ...

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Bibliographic Details
Main Authors SHIGA GOSHI, TAKAMOTO HISAHIDE, MIZUNO KOJI
Format Patent
LanguageEnglish
Published 24.07.2014
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide an adhesive sheet that can prevent breakdown of a circuit on a semiconductor chip in a production process of a semiconductor device.SOLUTION: In order to prevent breakdown of a semiconductor element caused by peeling electrification during pickup, a dicing tape integrated adhesive sheet 1 used in the production of a semiconductor device has a multilayered structure. In the adhesive sheet 1, the surface of any one outermost layer containing an antistatic agent has a surface specific resistance of 1.0×10 or less.
Bibliography:Application Number: JP20130088567