COPPER ELECTROPLATING BATH

• Main Authors: FUJIWARA MASAHIRO, KAWABATA AI
• Format: Patent
• Language: English
• Published: 07.07.2014
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

PROBLEM TO BE SOLVED: To provide a plating solution capable of preventing, on a copper plating occasion, warps of a plating film over time.SOLUTION: The provided copper electroplating bath is a copper plating solution including a soluble copper salt and an acid wherein no chlorine ions are included,...