COPPER ELECTROPLATING BATH

PROBLEM TO BE SOLVED: To provide a plating solution capable of preventing, on a copper plating occasion, warps of a plating film over time.SOLUTION: The provided copper electroplating bath is a copper plating solution including a soluble copper salt and an acid wherein no chlorine ions are included,...

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Bibliographic Details
Main Authors FUJIWARA MASAHIRO, KAWABATA AI
Format Patent
LanguageEnglish
Published 07.07.2014
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PROBLEM TO BE SOLVED: To provide a plating solution capable of preventing, on a copper plating occasion, warps of a plating film over time.SOLUTION: The provided copper electroplating bath is a copper plating solution including a soluble copper salt and an acid wherein no chlorine ions are included, wherein a phosphorus-containing compound selected from among inorganic phosphoric acids excluding pyrophosphoric acid and organic phosphonic acids is included, and wherein the pH thereof is 7 or below. Since the chlorine ion concentration is adjusted at zero or at a trace level in a state where the inorganic phosphoric acid or organic phosphonic acid coexists, a compressive stress is exerted onto a plating film obtained from the copper bath so as to resist a tensile stress exerted onto the film over time, and therefore, a film virtually free from warps over time can be formed.
Bibliography:Application Number: JP20120286021