PARTICLE BEAM LITHOGRAPHY PROCESS AND ESPECIALLY SIMULATION OF EFFECT OF SHOT NOISE IN PARTICLE BEAM LITHOGRAPHY PROCESS

PROBLEM TO BE SOLVED: To provide a particle beam lithography process and, especially a method of simulating the effect of shot noise in a particle beam lithography process, which is simpler than that of prior art and has a higher speed.SOLUTION: In a method including a step for depositing particles...

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Bibliographic Details
Main Author BELLEDENT JEROME
Format Patent
LanguageEnglish
Published 03.07.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a particle beam lithography process and, especially a method of simulating the effect of shot noise in a particle beam lithography process, which is simpler than that of prior art and has a higher speed.SOLUTION: In a method including a step for depositing particles on the surface of a sample in a preset pattern by using a beam composed of particles, with the pattern being subdivided into pixels and the nominal exposure dose of particles are associated with respective pixels, the process includes a deposition step for calculating the map of standard deviation of normalized exposure dose actually deposited on respective cells, and the map of standard deviation is calculated from a map Mof the nominal exposure dose associated with respective pixels, and a point spread function PSF characterizing the process. The method is executed by a computer.
Bibliography:Application Number: JP20130257608