POLYIMIDE PRECURSOR RESIN COMPOSITION
PROBLEM TO BE SOLVED: To provide a resin composition which enables formation of a cured film with low stress and resistance to swelling and a method of producing such a cured film.SOLUTION: A resin composition includes (a) and (b) components: (a) is a polyimide precursor; and (b) a metal complex com...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
03.07.2014
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a resin composition which enables formation of a cured film with low stress and resistance to swelling and a method of producing such a cured film.SOLUTION: A resin composition includes (a) and (b) components: (a) is a polyimide precursor; and (b) a metal complex compound represented by general formula (2), where R, R, R, R, Rand Rindependently represent a hydrogen atom or a univalent organic group. |
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Bibliography: | Application Number: JP20120279342 |